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Qualcomm Snapdragon 6 Series chips in the second half upgrade to 10nm process

In the recent MWC 2018 Mobile World Congress, MediaTek officially released the Helio P60 chip, which is based on TSMC 12nmFinFET process to create, using four Cortex A73 nuclear +4 Cortex A53 core composition, the highest CPU frequency 2.0GHz, GPU is Mali-G72 MP3, the frequency is 800MHz.

According to MediaTek Helio P60 chip data exposure, the chip positioning in the end, most likely is designed to counter Qualcomm Xiaolong 6 series from the chip. However, according to netizens recently revealed grass: the second half of 2018 Qualcomm Xiaolong 6 series chip upgrade to 10nm process technology across the board, and began to penetrate to the 4 Department of MediaTek formed a comprehensive siege. XC7Z010-1CLG400C

Seen in this light, MediaTek Helio P60 want to hit Qualcomm's chip status seems to be a long way to go. If Qualcomm 6 Series chip upgrade to 10nm process technology, not only the performance of a substantial upgrade, power consumption, fever control will also be fully upgraded, then most likely is the end of MediaTek defeat. MCP9700T-E/TT

According to foreign technology and media broke the news before, Qualcomm Snapdragon 670 will use a six-core design, and is based on the 10nm process technology manufacturing, two high-performance Kryo 300 Gold custom core version of the architecture, four low-power small core Kryo 300 Silver architecture, the two architectures are Qualcomm's new architecture based on ARM's A75, A55 architectures.